Reliability and Evaluation of Soldering Bonds in PTC ceramics
Kouichi INENAGA, Masanori SAITO, Takashi KAIMOTO
PTC, ceramics, electrode, solder, Curie point, reliability
Soldering was carried after the charging portions of the PTC ceramic electrode layer were fabricated, and then changes in the bond over time with voltage continuous or intermittent voltage application observed.
Results indicate that it is possible to fabricate bonds with longer service lives and higher reliability by optimizing solder volume lead wire diameter and solder material.