Notation | Material | Color | Density (g/cm3) | Hardness HV | Hardness HRA | Bending strengyth (MPa) | Young's modules (GPa) |
---|---|---|---|---|---|---|---|
NPA-2 | Al2O3+TiC | Black | 4.2 | 2000 | 94.0 | 840 | 390 |
NPA-03 | Al2O3 | White | 3.9 | 1700 | 92.5 | 520 | 310 |
NPZ-1 | ZrO2 | Gray | 6.0 | 1250 | 91.0 | 1800 | 210 |
NPZ-10 | ZrO2 | White | 6.0 | 1200 | 91.0 | 1500 | 190 |
NPZ-2 | ZrO2+NbC | Black | 6.5 | 1450 | 91.5 | 1700 | 240 |
NPZ-28 | ZrO2+WC | Black | 10.7 | 1650 | 92.5 | 2000 | 330 |
NPZ-96 | ZrO2 | Black | 6.0 | 1100 | 90.0 | 1300 | 180 |
NPS-1 | SiC | Gray | 3.1 | 2300 | 94.0* | 500 | 390 |
NPS-5 | SiC | Black | 3.1 | 2300 | 94.0* | 550 | 410 |
NPN-3 | Si3N4 | Black | 3.3 | 1850 | 93.5 | 1400 | 310 |
NPL-3 | AlN | Gray | 3.3 | 1000 | 87.0 | 400 | 310 |
NPCR-2 | Cordierite system | Black | 2.5 | 800 | - | 200 | 130 |
Notation | Material | Coefficient of thermal expansion (x10-6/K) | Thermal conductivity (W/(m*K)) | Electrical resistivity (Ω*m) | Thermal shock resistance Δs(K) | Withstand voltage (kV/mm) | Features |
---|---|---|---|---|---|---|---|
NPA-2 | Al2O3+TiC | 7.8 | 21 | 3~10-5 | 250 | - | Conductivity, Mirror finishing |
NPA-03 | Al2O3 | 7.4 | 30 | >1012 | -200 | 10.9 | Low coat, Wear resistance |
NPZ-1 | ZrO2 | 10.5 | 3 | >1012 | 300 | 8.4 | High strength, High toughness |
NPZ-10 | ZrO2 | 10.5 | 3 | >1012 | 300 | 8.9 | High strength, High toughness |
NPZ-2 | ZrO2+NbC | 9.4 | 4 | 3~10-5 | 300 | - | Conductivity, High strength |
NPZ-28 | ZrO2+WC | 8.5 | 15 | 1~10-6 | 350 | - | Conductivity, High strength |
NPZ-96 | ZrO2 | 10.8 | 3 | >1012 | -300 | 8.8 | high strength, Insulation, Color (Black) |
NPS-1 | SiC | 4.3 | 46 | >101 | 600 | - | High hardness, High rigidity, Thermal resistance |
NPS-5 | SiC | 4.2 | 100 | >103 | 600 | - | High hardness, High rigidity, Thermal resistance |
NPN-3 | Si3N4 | 3.4 | 25 | >1012 | 800 | 9.4 | High strength, Thermal shock resistance |
NPL-3 | AlN | 5 | 170 | >1012 | 400 | 10.9 | High thermal conductivity |
NPCR-2 | Cordierite system | 1.2 | 4 | >1012 | - | 12 | Low thermal expansion, Insulation |
Material/ Property | Anti-wear | High-strength | Iinsulation | Conductivity | Anti-heat | Anti-corrosion |
---|---|---|---|---|---|---|
Al2O3 NPA-5 | Nozzle, Yarn guide, Pipe liner, Transfer jig for semiconductor | Cutting tool | Conductive component | Refractory material, Heat processing container and tool, Catalyst support, | Crucible for medicine, Reaction vessel | |
Al2O3-TiC NPA-2 | Cutting tool, Magnetic slider | Bearing, Sleeve, Belt cleaner, Sliding component | Vacuum chuck, Manufactural component for semiconductor, Heater | Cutting tool | ||
ZrO2 NPZ-1 | Mold, Pulverizing ball, Kneader component, Manufactural component for semiconductor | Tablet mold, Die | Measurement tool, Manufactural component for semiconductor | |||
Conductive ZrO2 NPZ-2 | Mold, Cutting blade | Die, Thin blade | ||||
Si3N4 NPN-3 | Cutting tool, Bearing, Pulverizing ball, Nozzle, Gap separator | Squeeze roll for pipes, Gap separator, Bearing, Pulverizing component | Welding, Burner component, Temperature measuring tube, Turbo rotor, Diesel chamber, Glow plug | Bearing for medicine, Gas blowing tube, Impeller | ||
SiC NPS-1 | Sealring, Measurement contact | Imped case | Manufactural jig for semiconductor, Heater | Gas blowing tube, Impeller | ||
AlN NPL-2 | Bonding tool | Heat sink, Semiconductor substrate, Heat-equalization sink |