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ENGINEERING CERAMICS NPL-3; AlN (aluminum nitride) with high thermal conductivity

NPL-3; AlN (aluminum nitride) with high thermal conductivity
NPL-3 is the material having superb strength and toughness, with minute crystal structure organized by our original composing and possessing method. It also have a high degree of heat-radiation and the expansion coefficients that match silicones.

- Applications that requires rapid heating, rapid cooling and/or heat-radiation, such as semiconductor manufacturing machines and other peripheral components.
- Having high surface accuracy and excellent lapped surface due to very few pores.

Features of NPL- 3

1. High thermal conductivity: 170W/m*K
2. High strength: 400MPa in bending strength
3. High hardness: HV1000, HRA87
4. Low thermal expansion coefficient: 5.0x10-6/degrees Celsius (Silicones of 4.2x10-6)

Applications

Bonding tool
Heat sink
Semiconductor substrate
Dummy wafer, etc.

Maximum size of our achievements: 600Lx60x20, dia400x15

Maximum size of our achievements: 600Lx60x20, dia400x15

Inquiry

OVERSEAS SALES PROMOTION OFFICE
  • TEL +81-942-50-0053 / FAX +81-942-50-0054
Nippon Tungsten Co., Ltd.
2-8, Minoshima 1-chome, Hakata-ku, Fukuoka, 812-8538 Japan
Phone TEL +81-942-50-0053 / FAX +81-942-50-0054
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