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ENGINEERING CERAMICS NPL-2 and NPL- 3; AlN (aluminum nitride) with high thermal conductivity

NPL-2 and NPL- 3; AlN (aluminum nitride) with high thermal conductivity
NPL-2 and NPL-3 are the materials having superb strength and toughness, with minute crystal structure organized by our original composing and possessing method. They also have a high degree of heat-radiation and the expansion coefficients that match silicones.

- Applications that requires rapid heating, rapid cooling and/or heat-radiation, such as semiconductor manufacturing machines and other peripheral components.
- Having high surface accuracy and excellent lapped surface due to very few pores.

Features of NPL-2 and NPL- 3

1. High thermal conductivity: 170-180W/m*K
2. High strength: 400MPa in bending strength
3. High hardness: HV1000, HRA89
4. Low thermal expansion coefficient: 5.0x10-6/degrees Celsius (Silicones of 4.2x10-6)

Applications

Bonding tool
Heat sink
Semiconductor substrate
Dummy wafer, etc.

Differences between NPL-2 and NPL-3

There is no physical difference between them, however, NPL-3 is suitable for large products and NPL-2 for small ones because of their easiness in manufacturing.

As ceramic products tend to become larger and larger due to the shortening of manufacturing lines of semiconductors and the adopting of 12 inch-sized semiconductor wafers as the main types, we have been offering various products that can suit to the market demands by the combination of our processing methods of large components and micro machining technology.

Maximum size of our achievements: 500Lx65x30, dia300x30

Maximum size of our achievements: 500Lx65x30, dia300x30

Inquiry

OVERSEAS SALES PROMOTION OFFICE
  • TEL +81-942-50-0053 / FAX +81-942-50-0054
Nippon Tungsten Co., Ltd.
2-8, Minoshima 1-chome, Hakata-ku, Fukuoka, 812-8538 Japan
Phone TEL +81-942-50-0053 / FAX +81-942-50-0054
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